Jong Seo Park

Yonsei University - Seoul / South Korea

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AD Scientific Index ID: 4519155

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Jong Seo Park's MOST POPULAR ARTICLES

1-) A study on the bonding process of Cu bump/Sn/Cu bump bonding structure for 3D packaging applicationsB Lee, J Park, S Jeon, K Kwon, H LeeJournal of The Electrochemical Society 157 (4), H420, 2010412010

2-) Effects of bonding temperature and pressure on the electrical resistance of Cu/Sn/Cu joints for 3D integration applicationsB Lee, J Park, J Song, K Kwon, H LeeJournal of electronic materials 40 (3), 324-329, 2011192011

3-) Bi-layer high-k dielectrics of Al2O3/ZrO2 to reduce damage to MoS2 channel layers during atomic layer depositionWJ Woo, IK Oh, BE Park, Y Kim, J Park, S Seo, JG Song, H Jung, D Kim, ...2D Materials 6 (1), 015019, 2018

4-) Simultaneous improvement of the dielectric constant and leakage currents of ZrO 2 dielectrics by incorporating a highly valent Ta 5+ elementBE Park, IK Oh, JS Park, S Seo, D Thompson, H KimJournal of Materials Chemistry C 6 (36), 9794-9801, 2018

5-) Conduction mechanism change with transport oxide layer thickness in oxide hetero-interface diodeB Nam, JS Park, KH Lim, Y Ahn, J Lee, J Park, NK Cho, D Lee, HBR Lee, ...Applied Physics Letters 111 (5), 201772017

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