Jonghwan Ha

Jonghwan Ha

Binghamton University - Vestal / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 5701639
State University of New York at Binghamton
person_outline Jonghwan Ha's MOST POPULAR ARTICLES
1-) The effect of solder paste volume on solder joint shape and self-alignment of passive componentsK Pan, JH Ha, H Wang, J Xu, SB Park2020 IEEE 70th Electronic components and Technology conference (EcTc), 1289-1297, 2020272020
2-) An analysis of solder joint formation and self-alignment of chip capacitorsK Pan, JH Ha, H Wang, J Xu, S ParkIEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020232020
3-) The effect of misaligned passive component on fatigue life of solder joints and solder shapeJ Ha, K Pan, H Wang, DH Won, SB Park2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020232020
4-) The effect of solder paste volume on chip resistor solder joint fatigue lifeH Wang, K Pan, J Ha, C Cai, J Xu, S ParkProcedia Manufacturing 38, 1372-1380, 2019242019
5-) The effect of solder paste volume on surface mount assembly self-alignmentK Pan, JH Ha, HY Wang, V Veeraraghavan, SB ParkProcedia Manufacturing 38, 1381-1393, 2019202019