Jungsoo Kim

Samsung Electronics, South Korea - Gyeonggi / South Korea

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AD Scientific Index ID: 4597913

삼성전자, 한국

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Jungsoo Kim's MOST POPULAR ARTICLES

1-) Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn-3.0Ag-0.5Cu solder joints during current-stressingJ Kim, SB Jung, JW YoonJournal of Alloys and Compounds 850 (1), 156729, 2021272021

2-) Electromigration behaviors of Sn58% Bi solder containing Ag-coated MWCNTs with OSP surface finished PCBJ Kim, KH Jung, JH Kim, CJ Lee, SB JungJournal of Alloys and Compounds 775, 581-588, 2019262019

3-) Effects of aging treatment on mechanical properties of Sn-58Bi epoxy solder on ENEPIG-surface-finished PCBJ Kim, WR Myung, SB JungJournal of electronic materials 45, 5895-5903, 2016242016

4-) Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder jointsJ Kim, SB Jung, JW YoonApplied surface science 503, 144339, 2020222020

5-) Optimal Ni (P) thickness and reliability evaluation of thin-Au/Pd (P)/Ni (P) surface-finish with Sn-3.0 Ag-0.5 Cu solder jointsJ Kim, SB Jung, JW YoonJournal of Alloys and Compounds 805 (1), 1013-1024, 2019202019

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