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Kamal Sikka
AD Scientific Index 2024
Engineering & Technology / Electrical & Electronic Engineering
IBM Corporation - New York / United States
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Kamal Sikka's MOST POPULAR ARTICLES
1-)
Method and structure for cooling a dual chip module with one high power chipAR Arvelo, KK Sikka, HT ToyUS Patent 7,031,162, 20061032006
2-)
Segmentation of a die stack for 3D packaging thermal managementAR Arvelo, EG Colgan, JH Magerlein, KC Marston, KC Rivera, KK Sikka, ...US Patent 7,928,562, 2011932011
3-)
Method for controlling thermal interface gap distanceDL Edwards, MJ Emmett, S Iruvanti, RA Sherif, K Sikka, HT ToyUS Patent 6,294,408, 2001932001
4-)
Enhanced thermal management of 3-D stacked die packagingGK Bartley, DR Motschman, KK Sikka, JA Wakil, X Wei, J ZhengUS Patent 8,299,608, 2012852012
5-)
Analysis and optimization of a natural draft heat sink systemTS Fisher, KE Torrance, KK SikkaInterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM …, 1996561996
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