Karsten Meier

Karsten Meier

Technische Universität Dresden - Dresden / Germany
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 5977164
Dresden University of Technology
person_outline Karsten Meier's MOST POPULAR ARTICLES
1-) Creep measurements of 200 μm-400 μm solder jointsM Rollig, S Wiese, K Meier, KJ Wolter2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007272007
2-) The influence of size and composition on the creep of SnAgCu solder jointsS Wiese, M Roellig, M Mueller, S Rzepka, K Nocke, C Luhmann, ...2006 1st Electronic Systemintegration Technology Conference 2, 912-925, 2006222006
3-) Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loadingK Meier, M Roellig, A Schiessl, KJ Wolter2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014182014
4-) Life time prediction for lead-free solder joints under vibration loadsK Meier, M Roellig, A Schiessl, KJ Wolter2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011172011
5-) Experimental investigation of the visco-plastic mechanical properties of a Sn-based solder alloy for material modelling in Finite Element calculations of automotive electronicsR Metasch, M Roellig, A Kabakchiev, B Metais, R Ratchev, K Meier, ...2014 15th International Conference on Thermal, Mechanical and Mulit-Physics …, 2014152014