Katarina Boustedt

Katarina Boustedt

Research Institutes of Sweden - Stockholm / Sweden
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 5977337
person_outline Katarina Boustedt's MOST POPULAR ARTICLES
1-) Fundamental requirements on MEMS packaging and reliabilityK Persson, K Boustedt2002 Proceedings. 8th International Advanced Packaging Materials Symposium …, 2002472002
2-) GHz flip chip-an overviewK Boustedt1998 Proceedings. 48th Electronic Components and Technology Conference (Cat …, 1998461998
3-) Method of manufacturing a printed board assemblyL Bergstedt, P Ligander, K BoustedtUS Patent 7,051,430, 200639*2006
4-) Flip chip as an enabler for MEMS packagingK Boustedt, K Persson, D Stranneby52nd Electronic Components and Technology Conference 2002.(Cat. No …, 2002342002
5-) Development of Flip‐chip Joining Technology on Flexible Circuitry UsingAnistropically Conductive Adhesives and Eutectic SolderJ Liu, K Boustedt, Z LaiCircuit World 22 (2), 19-24, 1996181996