Keith Newman

Keith Newman

Advanced Micro Devices, Inc - Santa Clara / United States
Others
AD Scientific Index ID: 4491849
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person_outline Keith Newman's MOST POPULAR ARTICLES
1-) Method of making integrated circuit package having multiple bonding tiersKG NewmanUS Patent 5,490,324, 19961681996
2-) BGA brittle fracture-alternative solder joint integrity test methodsK NewmanProceedings Electronic Components and Technology, 2005. ECTC\\\'05., 1194-1201, 20051592005
3-) High-speed solder ball shear and pull tests vs. board level mechanical drop tests: correlation of failure mode and loading speedF Song, SWR Lee, K Newman, B Sykes, S Clark2007 Proceedings 57th Electronic Components and Technology Conference, 1504-1513, 2007862007
4-) Integrated circuit package lidKG NewmanUS Patent 5,455,456, 1995801995
5-) Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull testsF Song, SWR Lee, K Newman, B Sykes, S Clark2007 Proceedings 57th Electronic Components and Technology Conference, 364-372, 2007792007