Kejun Zeng

Kejun Zeng

Texas Instruments Inc. - Dallas / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4399513
-
person_outline Kejun Zeng's MOST POPULAR ARTICLES
1-) Six cases of reliability study of Pb-free solder joints in electronic packaging technologyK Zeng, KN TuMaterials science and engineering: R: reports 38 (2), 55-105, 200216382002
2-) Tin–lead (SnPb) solder reaction in flip chip technologyKN Tu, K ZengMaterials science and engineering: R: reports 34 (1), 1-58, 20017522001
3-) Kirkendall void formation in eutectic solder joints on bare and its effect on joint reliabilityK Zeng, R Stierman, TC Chiu, D Edwards, K Ano, KN TuJournal of applied physics 97 (2), 024508, 20054912005
4-) Effect of thermal aging on board level drop reliability for Pb-free BGA packagesTC Chiu, K Zeng, R Stierman, D Edwards, K Ano2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 20043652004
5-) Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5 Ag, Sn–3.8 Ag–0.7 Cu and Sn–0.7 Cu) on CuTY Lee, WJ Choi, KN Tu, JW Jang, SM Kuo, JK Lin, DR Frear, K Zeng, ...Journal of Materials Research 17 (2), 291-301, 20023212002