Keng-Hua Lin

Keng-Hua Lin

Intel Corporation - California / United States
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 5204372
-
person_outline Keng-Hua Lin's MOST POPULAR ARTICLES
1-) Thermal transport in SiGe superlattice thin films and nanowires: Effects of specimen and periodic lengths Physical Review B—Condensed Matter and Materials Physics 87 (11), 115302, 2013
2-) Mesodynamics with implicit degrees of freedom The Journal of Chemical Physics 141, 064107, 2014
3-) Effects of Cold-Rolling/Aging Treatments on the Shape Memory Properties of Ti49.3Ni50.7 Shape Memory Alloy Materials 10 (7), 704, 2017
4-) Role of direct electron-phonon coupling across metal-semiconductor interfaces in thermal transport via molecular dynamics The Journal of Chemical Physics 143 (3), 2015
5-) Limit for thermal transport reduction in Si nanowires with nanoengineered corrugations Applied Physics Letters 103 (24), 2013