Kiyokazu Yasuda

Kiyokazu Yasuda

Osaka University - Suita / Japan
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 460645
大阪大学
person_outline Kiyokazu Yasuda's MOST POPULAR ARTICLES
1-) Method of interconnecting terminals and method of mounting semiconductor devicesK Fujimoto, K Yasuda, J KimUS Patent 7,524,748, 2009552009
2-) New electrically conductive adhesives filled with low-melting-point alloy fillersJM Kim, K Yasuda, M Rito, K FujimotoMaterials transactions 45 (1), 157-160, 2004362004
3-) Effect of specimen size and aging on tensile properties of Sn-Ag-Cu lead-free soldersI Shohji, T Osawa, T Matsuki, Y Kariya, K Yasuda, T TakemotoMaterials Transactions 49 (5), 1175-1179, 2008342008
4-) Novel interconnection method using electrically conductive paste with fusible fillerJM Kim, K Yasuda, K FujimotoJournal of electronic materials 34, 600-604, 2005342005
5-) Adhesive joining process and joint property with low melting point fillerK Yasuda, JM Kim, K FujimotoJ. Electron. Packag. 127 (1), 12-17, 2005322005