Kuan Neng Chen

Kuan Neng Chen

National Yang Ming Chiao Tung University - Taipei / Taiwan
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 350212
台湾阳明交通大学
person_outline Kuan Neng Chen's MOST POPULAR ARTICLES
1-) Method of forming a multi-layer semiconductor structure incorporating a processing handle memberR Reif, KN Chen, CS Tan, A FanUS Patent 7,307,003, 20072402007
2-) Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned CuCM Liu, HW Lin, YS Huang, YC Chu, C Chen, DR Lyu, KN Chen, KN TuScientific reports 5 (1), 9734, 20152472015
3-) Wafer-level bonding/stacking technology for 3D integrationCT Ko, KN ChenMicroelectronics reliability 50 (4), 481-488, 20102342010
4-) Wafer-level 3D integration technologySJ Koester, AM Young, RR Yu, S Purushothaman, KN Chen, ...IBM Journal of Research and Development 52 (6), 583-597, 20082432008
5-) Three-dimensional integrated circuit (3D IC) key technology: Through-silicon via (TSV)WW Shen, KN ChenNanoscale research letters 12, 1-9, 20172092017