Kyung Deuk Min

Kyung Deuk Min

Sungkyunkwan University - Seoul / South Korea
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 4505119
성균관대학교
person_outline Kyung Deuk Min's MOST POPULAR ARTICLES
1-) Mechanical properties of Sn-58 wt% Bi solder containing Ag-decorated MWCNT with thermal aging testsCJ Lee, KD Min, HJ Park, SB JungJournal of Alloys and Compounds 820, 153077, 2020342020
2-) Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packagesKH Jung, KD Min, CJ Lee, BG Park, H Jeong, JM Koo, B Lee, SB JungApplied Surface Science 495, 143487, 2019262019
3-) Intense pulsed light surface treatment for improving adhesive bonding of aluminum and carbon fiber reinforced plastic (CFRP)JH Kim, CJ Lee, KD Min, BU Hwang, DG Kang, DH Choi, J Joo, SB JungComposite Structures 258, 113364, 2021242021
4-) Pressureless die attach by transient liquid phase sintering of Cu nanoparticles and Sn-58Bi particles assisted by polyvinylpyrrolidone dispersantKH Jung, KD Min, CJ Lee, SB JungJournal of Alloys and Compounds 781, 657-663, 2019232019
5-) Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bondingHS Joo, CJ Lee, KD Min, BU Hwang, SB JungJournal of Materials Science: Materials in Electronics 31, 22926-22932, 2020222020