Liang Yin

Liang Yin

General Electric Company - Boston / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4377823
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person_outline Liang Yin's MOST POPULAR ARTICLES
1-) Recrystallization and precipitate coarsening in Pb-free solder joints during thermomechanical fatigueL Yin, L Wentlent, L Yang, B Arfaei, A Qasaimeh, P BorgesenJournal of Electronic Materials 41 (2), 241-252, 20121422012
2-) On the root cause of Kirkendall voiding in Cu3SnL Yin, P BorgesenJournal of Materials Research 26 (3), 455-466, 20111022011
3-) Dissolutive wetting in the Bi–Sn systemL Yin, BT Murray, TJ SinglerActa materialia 54 (13), 3561-3574, 2006942006
4-) Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface: Plating in acidic copper solution with and without …Y Liu, J Wang, L Yin, P Kondos, C Parks, P Borgesen, DW Henderson, ...Journal of applied electrochemistry 38, 1695-1705, 2008932008
5-) Wetting in the Au–Sn systemL Yin, SJ Meschter, TJ SinglerActa Materialia 52 (10), 2873-2888, 2004802004