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Mariam Sadaka
Soitec - / France
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AD Scientific Index ID: 4970112
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Mariam Sadaka's MOST POPULAR ARTICLES
1-)
Inverse slope isolation and dual surface orientation integration MG Sadaka, D Eades, J Mogab, BY Nguyen, MO Zavala, GS Spencer US Patent 7,575,968, 2009 3392009
2-)
Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region M Sadaka, I Radu US Patent 8,461,017, 2013 2262013
3-)
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking I Radu, D Landru, G Gaudin, G Riou, C Tempesta, F Letertre, L Di Cioccio, ... 2010 IEEE International 3D Systems Integration Conference (3DIC), 1-6, 2010 2092010
4-)
Direct bonding for wafer level 3D integrationL Di Cioccio, I Radu, P Gueguen, M Sadaka2010 IEEE International Conference on Integrated Circuit Design and …, 20102442010
5-)
Low temperature direct wafer to wafer bonding for 3D integrationG Gaudin, G Riou, M Sadaka, K Winstel, E Kinser3D Systems Integration Conference (3DIC), IEEE, 16-18, 20102362010
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