Mathias Nowottnick

Mathias Nowottnick

Universität Rostock - Rostock / Germany
Others
AD Scientific Index ID: 1786900
University of Rostock
person_outline Mathias Nowottnick's MOST POPULAR ARTICLES
1-) Reduction of voids in solder joints an alternative to vacuum solderingR Diehm, M Nowottnick, U PapeProceedings of the IPC APEX EXPO 8, 2012352012
2-) Comparison of WTi and WTi (N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of TiM Fugger, M Plappert, C Schäffer, O Humbel, H Hutter, H Danninger, ...Microelectronics Reliability 54 (11), 2487-2493, 2014342014
3-) Thermal peak management using organic phase change materials for latent heat storage in electronic applicationsJ Maxa, A Novikov, M NowottnickMaterials 11 (1), 31, 2017242017
4-) Interconnection of silicon heterojunction solar cells by infrared soldering-solder joint analysis and temperature studyA De Rose, T Geipel, D Eberlein, A Kraft, M NowottnickProceedings of the 36th European Photovoltaic Solar Energy Conference and …, 2019252019
5-) Soldering material based on Sn Ag and CuHJ Albrecht, KHG Bartl, W Kruppa, K Müller, M Nowottnick, G Petzold, ...US Patent 10,376,994, 2019182019