Mohammad Ashraful Haq

Mohammad Ashraful Haq

Auburn University - Auburn / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 5306353
person_outline Mohammad Ashraful Haq's MOST POPULAR ARTICLES
1-) Effects of test temperature and prior aging on the cyclic stress-strain behavior of lead free solders International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019
2-) Determination of anand parameters from creep testing of sac305 solder joints International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020
3-) Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022
4-) Anand parameters for eutectic tin-bismuth solder 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021
5-) Mechanical behavior and microstructure evolution in lead free solders subjected to mechanical cycling at elevated temperatures 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2340-2347, 2021