Muhammad Salman Al Farisi

Muhammad Salman Al Farisi

Hiroshima City University - Hiroshima / Japan
Others
AD Scientific Index ID: 4593313
広島市立大学
person_outline Muhammad Salman Al Farisi's MOST POPULAR ARTICLES
1-) Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cuttingMS Al Farisi, H Hirano, J Frömel, S TanakaJournal of Micromechanics and Microengineering 27 (1), 015029, 2016442016
2-) Aluminum Patterned Electroplating from AlCl3–[EMIm]Cl Ionic Liquid towards Microsystems ApplicationMS Al Farisi, S Hertel, M Wiemer, T OttoMicromachines 9 (11), 589, 2018222018
3-) Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packagingMS Al Farisi, H Hirano, S TanakaSensors and Actuators A: Physical 279, 671-679, 2018222018
4-) Advancements in MEMS technology for medical applications: Microneedles and miniaturized sensorsM Shikida, Y Hasegawa, MS Al Farisi, M Matsushima, T KawabeJapanese Journal of Applied Physics 61 (SA), SA0803, 2021182021
5-) Tailoring material properties of electrochemically deposited Al film from chloroaluminate ionic liquid for microsystem technology using pulsed depositionMS Al Farisi, T Tsukamoto, S TanakaSensors and Actuators A: Physical 316, 112384, 202082020