Nicolas Boyer

IBM Corporation - New York / United States

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AD Scientific Index ID: 4464753

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Nicolas Boyer's MOST POPULAR ARTICLES

1-) A novel approach to photonic packaging leveraging existing high-throughput microelectronic facilities IEEE Journal of Selected Topics in Quantum Electronics 22 (6), 455-466, 2016

2-) Integrated metamaterial interfaces for self-aligned fiber-to-chip coupling in volume manufacturing IEEE Journal of Selected Topics in Quantum Electronics 25 (3), 1-13, 2018

3-) Automated, high-throughput photonic packaging Optical Fiber Technology 44, 24-35, 2018

4-) Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 179-185, 2014

5-) Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 775-782, 2015

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