Olivér Krammer

Olivér Krammer

Budapest University of Technology and Economics - Budapest / Hungary
Economics & Econometrics / Economics
AD Scientific Index ID: 1845592
Budapesti Muszaki és Gazdaságtudományi Egyetem
person_outline Olivér Krammer's MOST POPULAR ARTICLES
1-) Solder paste scooping detection by multilevel visual inspection of printed circuit boardsC Benedek, O Krammer, M Janóczki, L JakabIEEE Transactions on Industrial Electronics 60 (6), 2318-2331, 2012642012
2-) Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase solderingO KrammerSoldering & Surface Mount Technology 26 (4), 214-222, 2014552014
3-) Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronicsB Medgyes, B Horváth, B Illés, T Shinohara, A Tahara, G Harsányi, ...Corrosion Science 92, 43-47, 2015542015
4-) Modelling the self-alignment of passive chip components during reflow solderingO KrammerMicroelectronics Reliability 54 (2), 457-463, 2014492014
5-) Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content soldersO Krammer, T Garami, B Horváth, T Hurtony, B Medgyes, L JakabJournal of Alloys and Compounds 634, 156-162, 2015422015