Paul Vianco

Paul Vianco

Sandia National Laboratories - New Mexico / United States
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 4414454
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person_outline Paul Vianco's MOST POPULAR ARTICLES
1-) Intermetallic growth and mechanical behavior of low and high melting temperature solder alloysDR Frear, PT ViancoMetallurgical and Materials Transactions A 25 (7), 1509-1523, 19943281994
2-) Issues in the replacement of lead-bearing soldersPT Vianco, DR FrearJom 45 (7), 14-19, 19932901993
3-) Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatingsPT Vianco, PF Hlava, AC KilgoJournal of electronic materials 23 (7), 583-594, 19942191994
4-) Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: experimental analysisPT Vianco, KL Erickson, PL HopkinsJournal of Electronic Materials 23, 721-727, 19941841994
5-) Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysisPT Vianco, JA RejentJournal of electronic materials 28, 1127-1137, 19991701999