Peter Ze Zhu

Peter Ze Zhu

City University of Hong Kong - Coimbatore / Hong Kong
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4578052
person_outline Peter Ze Zhu's MOST POPULAR ARTICLES
1-) Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0. 3Ag0. 7Cu-CNTs solderZ Zhu, YC Chan, Z Chen, CL Gan, F WuMaterials Science and Engineering: A 727, 160-169, 2018462018
2-) Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressingZ Zhu, YC Chan, F WuMicroelectronics Reliability 91, 179-182, 2018182018
3-) Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methodsYC Ze Zhu , Huayu Sun, Fengshun WuJournal of Materials Science: Materials in Electronics, 2016182016
4-) Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnectZ Zhu, Y Chan, F WuMicroelectronics Reliability 92, 12-19, 2019152019
5-) Environmental impact analysis of smartwatch using SimaPro8 tools and energy dispersive X-ray spectroscopy (EDX) techniqueMMM Ma, Z Zhu, YC Chan2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-6, 201792017