Piotr Ciszewski

Piotr Ciszewski

Warsaw University of Technology - Warsaw / Poland
Others
AD Scientific Index ID: 5433571
Politechnika Warszawska
person_outline Piotr Ciszewski's MOST POPULAR ARTICLES
1-) Influence of assembly parameters on lead-free solder joints reliability in package-on-package (PoP) technologyJ Sitek, W Stęplewski, K Janeczek, M Kościelski, K Lipiec, P Ciszewski, ...Soldering & Surface Mount Technology 27 (3), 98-102, 2015122015
2-) A comparative analysis of printed circuit drying methods for the reliability of assembly processP Ciszewski, M Sochacki, W Stęplewski, MarekKościelski, A Araźna, ...Microelectronics Reliability 129, 114478, 2022102022
3-) Materials and soldering challenges in lead-free package-on-package (PoP) technologyM Kościelski, J Sitek, W Stęplewski, G Kozioł, P Ciszewski, T KrzaczekSoldering & Surface Mount Technology 27 (3), 103-107, 201592015
4-) Marketing sąsiedztwa-stosowanie metod komunikacji mobilnej w działaniach marketingowychR Szulc, P CiszewskiMarketing i Rynek, 24-32, 2013
5-) Investigations of temperature resistance of memory BGA components during multi-reflow processes for Circular Economy applicationsJ Sitek, M Koscielski, P Dawidowicz, P Ciszewski, M Khramova, ...2017 21st European Microelectronics and Packaging Conference (EMPC …, 201762017