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Praneet Adusumilli
IBM Corporation - New York / United States
Engineering & Technology / Computer Science
AD Scientific Index ID: 4464924
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Praneet Adusumilli's MOST POPULAR ARTICLES
1-)
Recessed metal liner contact with copper fillP Adusumilli, VS Basker, H Bu, Z LiuUS Patent 9,496,225, 20161562016
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A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channelsR Xie, P Montanini, K Akarvardar, N Tripathi, B Haran, S Johnson, T Hook, ...2016 IEEE International Electron Devices Meeting (IEDM), 2.7. 1-2.7. 4, 20161392016
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Future on-chip interconnect metallization and electromigrationCK Hu, J Kelly, H Huang, K Motoyama, H Shobha, Y Ostrovski, JHC Chen, ...2018 IEEE International Reliability Physics Symposium (IRPS), 4F. 1-1-4F. 1-6, 2018522018
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Tungsten and cobalt metallization: A material study for MOL local interconnectsV Kamineni, M Raymond, S Siddiqui, F Mont, S Tsai, C Niu, A Labonte, ...2016 IEEE International Interconnect Technology Conference/Advanced …, 2016592016
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Confined PCM-based Analog Synaptic Devices offering Low Resistance-drift and 1000 Programmable States for Deep LearningW Kim, RL Bruce, T Masuda, GW Fraczak, N Gong, P Adusumilli, ...2019 Symposium on VLSI Technology, T66-T67, 2019582019
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