Qianwen Chen

Qianwen Chen

Tsinghua University - Beijing / China
Engineering & Technology / Electrical & Information Engineering
AD Scientific Index ID: 726479
清华大学
person_outline Qianwen Chen's MOST POPULAR ARTICLES
1-) High aspect ratio copper through-silicon-vias for 3D integrationC Song, Z Wang, Q Chen, J Cai, L LiuMicroelectronic Engineering 85 (10), 1952-1956, 2008772008
2-) Low capacitance through-silicon-vias with uniform benzocyclobutene insulation layersQ Chen, C Huang, Z Tan, Z WangIEEE Transactions on Components, Packaging and Manufacturing Technology 3 (5 …, 2013472013
3-) Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) networkZ Xu, A Beece, D Zhang, Q Chen, KN Chen, K Rose, JQ Lu3D Systems Integration Conference (3DIC), 2010 IEEE International, 1-8, 2010452010
4-) High aspect ratio and low capacitance through-silicon-vias (TSVs) with polymer insulation layersC Huang, Q Chen, D Wu, Z WangMicroelectronic Engineering 104, 12-17, 2013392013
5-) Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs)Q Chen, C Huang, Z WangMicroelectronics Reliability 52 (11), 2670-2676, 2012392012