Ramani Mayappan

Ramani Mayappan

Kwik Kian Gie School of Business - Jakarta / Indonesia
Others
AD Scientific Index ID: 4496036
Sekolah Bisnis Kwik Kian Gie
person_outline Ramani Mayappan's MOST POPULAR ARTICLES
1-) Effect of Bi addition on the activation energy for the growth of Cu5Zn8 intermetallic in the Sn–Zn lead-free solderR Mayappan, ZA AhmadIntermetallics 18 (4), 730-735, 2010882010
2-) The effect of crosshead speed on the joint strength between Sn-Zn-Bi lead-free solders and Cu substrateR Mayappan, AB Ismail, ZA Ahmad, T Ariga, LB HussainJournal of alloys and compounds 436 (1-2), 112-117, 2007452007
3-) Effect of sample perimeter and temperature on Sn–Zn based lead-free soldersR Mayappan, AB Ismail, ZA Ahmad, T Ariga, LB HussainMaterials Letters 60 (19), 2383-2389, 2006352006
4-) The effect of adding Zn into the Sn–Ag–Cu solder on the intermetallic growth rateR Mayappan, I Yahya, NA Ab Ghani, HA HamidJournal of Materials Science: Materials in Electronics 25 (7), 2913-2922, 2014332014
5-) Phase development in La2O3 doped Al2O3: TiO2 ceramic membranesUS Bjoerkert, R Mayappan, D Holland, MH LewisJournal of the European Ceramic Society 19 (10), 1847-1857, 1999181999