Rongfu Wen(温荣福)

Rongfu Wen(温荣福)

Dalian University of Technology - Dalian / China
Engineering & Technology / Mechanical Engineering
AD Scientific Index ID: 734029
大连理工大学
person_outline Rongfu Wen(温荣福)'s MOST POPULAR ARTICLES
1-) Hydrophobic copper nanowires for enhancing condensation heat transferR Wen, Q Li, J Wu, G Wu, W Wang, Y Chen, X Ma, D Zhao, R YangNano Energy 33, 177-183, 20172432017
2-) Three-dimensional superhydrophobic nanowire networks for enhancing condensation heat transferR Wen, S Xu, X Ma, YC Lee, R YangJoule 2 (2), 269-279, 20182412018
3-) Enhanced bubble nucleation and liquid rewetting for highly efficient boiling heat transfer on two-level hierarchical surfaces with patterned copper nanowire arraysR Wen, Q Li, W Wang, B Latour, CH Li, C Li, YC Lee, R YangNano Energy 38, 59-65, 20172092017
4-) Experimental investigation on steam condensation heat transfer enhancement with vertically patterned hydrophobic–hydrophilic hybrid surfacesB Peng, X Ma, Z Lan, W Xu, R WenInternational Journal of Heat and Mass Transfer 83, 27-38, 20152232015
5-) Liquid-vapor phase-change heat transfer on functionalized nanowired surfaces and beyondR Wen, X Ma, YC Lee, R YangJoule 2 (11), 2307-2347, 20182162018