Saptadeep Pal

Saptadeep Pal

University of California Los Angeles - Los Angeles / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4586078
University of California
person_outline Saptadeep Pal's MOST POPULAR ARTICLES
1-) Heterogeneous integration at fine pitch (≤ 10 µm) using thermal compression bondingAA Bajwa, SC Jangam, S Pal, N Marathe, T Bai, T Fukushima, M Goorsky, ...2017 IEEE 67th electronic components and technology conference (ECTC), 1276-1284, 2017762017
2-) Optimizing multi-GPU parallelization strategies for deep learning trainingS Pal, E Ebrahimi, A Zulfiqar, Y Fu, V Zhang, S Migacz, D Nellans, ...Ieee Micro 39 (5), 91-101, 2019532019
3-) Architecting waferscale processors-a GPU case studyS Pal, D Petrisko, M Tomei, P Gupta, SS Iyer, R Kumar2019 IEEE International Symposium on High Performance Computer Architecture …, 2019562019
4-) Latency, bandwidth and power benefits of the superchips integration schemeSC Jangam, S Pal, A Bajwa, S Pamarti, P Gupta, SS Iyer2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 86-94, 2017582017
5-) Design space exploration for chiplet-assembly-based processorsS Pal, D Petrisko, R Kumar, P GuptaIEEE Transactions on Very Large Scale Integration (VLSI) Systems 28 (4 …, 2020382020