Satyanarayana V Nitta

Satyanarayana V Nitta

IBM Corporation - New York / United States
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 4465213
person_outline Satyanarayana V Nitta's MOST POPULAR ARTICLES
1-) Multi component dielectric layer US Patent 8,357,608, 2013
2-) METHOD OF PE-ALD OF SiNxCy AND INTEGRATION OF LINER MATERIALS ON POROUS LOW K SUBSTRATES US Patent App. 12/203,338, 2010
3-) Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics US Patent 7,179,758, 2007
4-) Method for air gap interconnect integration using photo-patternable low k material US Patent 8,241,992, 2012
5-) Microelectronic structure including air gap US Patent 8,288,268, 2012