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Seok Kim
University of Illinois Urbana Champaign - Champaign / United States
Engineering & Technology / Mechanical Engineering
AD Scientific Index ID: 1616157
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Seok Kim's MOST POPULAR ARTICLES
1-)
Microstructured elastomeric surfaces with reversible adhesion and examples of their use in deterministic assembly by transfer printingS Kim, J Wu, A Carlson, SH Jin, A Kovalsky, P Glass, Z Liu, N Ahmed, ...Proceedings of the National Academy of Sciences 107 (40), 17095-17100, 20105042010
2-)
Biologically inspired polymer microfibers with spatulate tips as repeatable fibrillar adhesivesS Kim, M SittiApplied physics letters 89, 261911, 20064322006
3-)
Enhanced adhesion by gecko-inspired hierarchical fibrillar adhesivesMP Murphy, S Kim, M SittiACS applied materials & interfaces 1 (4), 849-855, 20093582009
4-)
Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lightingH Kim, E Brueckner, J Song, Y Li, S Kim, C Lu, J Sulkin, K Choquette, ...Proceedings of the National Academy of Sciences 108 (25), 10072, 20112912011
5-)
Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesionE Menard, JA Rogers, S Kim, A CarlsonUS Patent 9,412,727, 20162212016
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