Seokjun Hong

Seokjun Hong

Sungkyunkwan University - Seoul / South Korea
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4520977
성균관대학교
person_outline Seokjun Hong's MOST POPULAR ARTICLES
1-) Improvement of oxide removal rate in chemical mechanical polishing by forming oxygen vacancy in ceria abrasives via ultraviolet irradiationE Kim, J Hong, S Hong, C Kanade, H Seok, HU Kim, T KimMaterials Chemistry and Physics 273, 124967, 2021152021
2-) A water polishing process to improve ceria abrasive removalS Hong, J Kim, J Won, N Qureshi, S Chae, Y Wada, H Hiyama, S Hamada, ...ECS Journal of Solid State Science and Technology 8 (8), P430, 2019202019
3-) Effect of conditioner load on the polishing pad surface during chemical mechanical planarization processC Shin, H Qin, S Hong, S Jeon, A Kulkarni, T KimJournal of Mechanical Science and Technology 30, 5659-5665, 2016202016
4-) Investigation of the pad-conditioning performance deterioration in the chemical mechanical polishing processH Kim, S Hong, C Shin, Y Jin, DH Lim, J Kim, H Hwang, T KimWear 392, 93-98, 2017172017
5-) Investigation of thermal effects in copper chemical mechanical polishingP Liu, S Bae, S Hong, C Bae, H Seo, J Lee, C Tang, T KimPrecision Engineering 73, 195-202, 2022152022