Seung-Hyun Chae (채승현)

Seung-Hyun Chae (채승현)

University of Texas Austin - Austin / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 1676437
University of Texas at Austin
person_outline Seung-Hyun Chae (채승현)'s MOST POPULAR ARTICLES
1-) Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealingB Chao, SH Chae, X Zhang, KH Lu, J Im, PS HoActa Materialia 55 (8), 2805-2814, 20072452007
2-) Electromigration enhanced intermetallic growth and void formation in Pb-free solder jointsB Chao, SH Chae, X Zhang, KH Lu, M Ding, J Im, PS HoJournal of applied physics 100 (8), 084909, 20061262006
3-) Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder jointsBHL Chao, X Zhang, SH Chae, PS HoMicroelectronics Reliability 49 (3), 253-263, 2009882009
4-) Characterization of viscoelasticity of molding compounds in time domainSH Chae, JH Zhao, DR Edwards, PS HoJournal of Electronic Materials 39 (4), 419-425, 2009932009
5-) Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packagesSH Chae, X Zhang, KH Lu, HL Chao, PS Ho, M Ding, P Su, T Uehling, ...Journal of Materials Science: Materials in Electronics 18 (1-3), 247-258, 200783*2007