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Sharon Lim Pei Siang
A*STAR Singapore - - / Singapore
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AD Scientific Index ID: 4580720
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Sharon Lim Pei Siang's MOST POPULAR ARTICLES
1-)
Development of high density fan out wafer level package (HD FOWLP) with multi-layer fine pitch RDL for mobile applicationsVS Rao, CT Chong, D Ho, DM Zhi, CS Choong, LPS Sharon, D Ismael, ...2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1522-1529, 20161122016
2-)
Development of fine pitch solder microbumps for 3D chip stackingA Yu, A Kumar, SW Ho, HW Yin, JH Lau, KC Houe, SLP Siang, X Zhang, ...2008 10th Electronics Packaging Technology Conference, 387-392, 2008342008
3-)
Process and reliability of large fan-out wafer level package based package-on-packageVS Rao, CT Chong, D Ho, DM Zhi, CS Choong, SL PS, D Ismael, ...2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 615-622, 2017332017
4-)
A novel packaging platform for high-performance optical engines in hyperscale data center applicationsSBN Gourikutty, MC Jong, CV Kanna, DSW Ho, SW Wei, SLP Siang, J Wu, ...2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 422-427, 2022152022
5-)
Heterogeneous integration with embedded fine interconnectCT Chong, LT Guan, D Ho, H Yong, CS Choong, SLP Siang, ...2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2216-2221, 2021152021
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