Shuibao Liang

Shuibao Liang

Loughborough University - Loughborough / United Kingdom
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 6039218
person_outline Shuibao Liang's MOST POPULAR ARTICLES
1-) Phase field simulation of microstructural evolution and thermomigration-induced phase segregation in Cu/Sn58Bi/Cu interconnects under isothermal aging and temperature gradientSB Liang, CB Ke, JQ Huang, MB Zhou, XP ZhangMicroelectronics Reliability 92, 1-11, 2019222019
2-) Numerical simulations of migration and coalescence behavior of microvoids driven by diffusion and electric field in solder interconnectsSB Liang, CB Ke, WJ Ma, MB Zhou, XP ZhangMicroelectronics Reliability 71, 71-81, 2017192017
3-) Size effects on the interfacial reaction and microstructural evolution of Sn-ball/Sn3. 0Ag0. 5Cu-paste/Cu joints in board-level hybrid BGA interconnection at critical reflowing …JQ Huang, MB Zhou, SB Liang, XP ZhangJournal of Materials Science: Materials in Electronics 29, 7651-7660, 2018182018
4-) Insight into the preferential grain growth of intermetallics under electric current stressing–A phase field modelingS Liang, A Kunwar, C Wei, C KeScripta Materialia 203, 114071, 2021122021
5-) Study of the influence of elastic anisotropy of Cu on thermo-mechanical behavior and Cu protrusion of through silicon vias using combined phase field and finite element methodsSB Liang, CB Ke, C Wei, MB Zhou, XP ZhangIEEE Transactions on Device and Materials Reliability 19 (2), 322-332, 2019122019