Siliang He

Guilin University of Electronic Technology - Guilin / China

Engineering & Technology / Electrical & Electronic Engineering

AD Scientific Index ID: 4508164

桂林电子科技大学

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Siliang He's MOST POPULAR ARTICLES

1-) Thermally stable Cu3Sn/Cu composite joint for high-temperature power deviceX Liu, S He, H NishikawaScripta Materialia 110, 101-104, 2016832016

2-) Low temperature solid-state bonding using Sn-coated Cu particles for high temperature die attachX Liu, S He, H NishikawaJournal of Alloys and Compounds 695, 2165-2172, 2017532017

3-) Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bondingR Gao, S He, J Li, YA Shen, H NishikawaJournal of Materials Science: Materials in Electronics 31, 14635-14644, 2020

4-) Effect of substrates on fracture mechanism and process optimization of oxidation–reduction bonding with copper microparticlesR Gao, S He, YA Shen, H NishikawaJournal of Electronic Materials 48, 2263-2271, 2019

5-) In-situ observation of fluxless soldering of Sn-3.0 Ag-0.5 Cu/Cu under a formic acid atmosphereS He, R Gao, J Li, YA Shen, H NishikawaMaterials Chemistry and Physics 239, 122309, 2020262020

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