Sivasubramanian Thirugnanasambandam

Sivasubramanian Thirugnanasambandam

Auburn University - Auburn / United States
Engineering & Technology / Computer Science
AD Scientific Index ID: 843166
person_outline Sivasubramanian Thirugnanasambandam's MOST POPULAR ARTICLES
1-) Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packagesJ Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ...IEEE transactions on components, packaging and manufacturing technology 3 (8 …, 20131242013
2-) Correlation of Aging Effects on Creep Rate and Reliability in Lead Free Solder JointsJCS Jiawei Zhang, Zhou Hai, SivasubramanianSMTA Journal 25 (3), 19-28, 20121202012
3-) Impact of isothermal aging on the long-term reliability of fine-pitch ball grid array packages with different Sn-Ag-Cu solder jointsJ Zhang, S Thirugnanasambandam, JL Evans, MJ Bozack, R SesekIEEE Transactions on Components, Packaging and Manufacturing Technology 2 (8 …, 2012402012
4-) Drop impact reliability testing of isothermally aged doped low creep lead-free solder paste alloysS Sridhar, A Raj, S Gordon, S Thirugnanasambandam, JL Evans, ...2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016212016
5-) Comparative study on impact of various low creep doped lead free solder alloysA Raj, S Sridhar, S Thirugnanasambandam, T Sanders, S Hamasha, ...SMTA International Conference Proceedings, 2017202017