Swarnakamal Priyabadini

Swarnakamal Priyabadini

Ghent University - Ghent / Belgium
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 5690551
Universiteit Gent
person_outline Swarnakamal Priyabadini's MOST POPULAR ARTICLES
1-) High-yield fabrication process for 3D-stacked ultrathin chip packages using photo-definable polyimide and symmetry in packagesS Priyabadini, T Sterken, M Cauwe, L Van Hoorebeke, J VanfleterenIEEE Transactions on Components, Packaging and Manufacturing Technology 4 (1 …, 2013182013
2-) 3-D stacking of ultrathin chip packages: An innovative packaging and interconnection technologyS Priyabadini, T Sterken, L Van Hoorebeke, J VanfleterenIEEE Transactions on Components, Packaging and Manufacturing Technology 3 (7 …, 2013122013
3-) High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based Ultra-Thin Chip package (UTCP)T Sterken, M Op de Beeck, F Vermeiren, T Torfs, L Wang, S Priyabadini, ...International Symposium on Microelectronics 2012 (1), 000940-000945, 201282012
4-) Module miniaturization by ultra thin package stackingT Löher, D Schütze, A Ostmann, R Aschenbrenner2010 IEEE CPMT Symposium Japan, 1-4, 201072010
5-) An approach to produce a stack of photo definable polyimide based flat UTCPsS Priyabadini, T Sterken, L Wang, K Dhaenens, B Vandecasteele, ...2012 4th Electronic System-Integration Technology Conference, 1-4, 201262012