Takafumi Fukushima

Takafumi Fukushima

Tohoku University - Sendai / Japan
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 416626
東北大学
person_outline Takafumi Fukushima's MOST POPULAR ARTICLES
1-) High-density through silicon vias for 3-D LSIs Proceedings of the IEEE 97 (1), 49-59, 2009
2-) Three-dimensional integration technology and integrated systems 2009 Asia and South Pacific Design Automation Conference, 409-415, 2009
3-) New three-dimensional integration technology using self-assembly technique IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest …, 2005
4-) Three-dimensional hybrid integration technology of CMOS, MEMS, and photonics circuits for optoelectronic heterogeneous integrated systems IEEE Transactions on Electron Devices 58 (3), 748-757, 2010
5-) New three-dimensional integration technology based on reconfigured wafer-on-wafer bonding technique 2007 IEEE International Electron Devices Meeting, 985-988, 2007