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Thierry Lacrevaz
Université de Savoie Mont Blanc - Chambéry / France
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AD Scientific Index ID: 917724
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Thierry Lacrevaz's MOST POPULAR ARTICLES
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High frequency characterization and modeling of high density TSV in 3D integrated circuitsC Bermond, L Cadix, A Farcy, T Lacrevaz, P Leduc, B Flechet2009 IEEE Workshop on Signal Propagation on Interconnects, 1-4, 2009822009
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Investigation on TSV impact on 65nm CMOS devices and circuitsH Chaabouni, M Rousseau, P Leduc, A Farcy, R El Farhane, A Thuaire, ...2010 International Electron Devices Meeting, 35.1. 1-35.1. 4, 2010612010
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Ferroelectric properties of Pb (Zr, Ti) O3 thin films until 40 GHzE Defay, T Lacrevaz, TT Vo, V Sbrugnera, C Bermond, M Aid, B FlechetApplied Physics Letters 94 (5), 2009322009
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Evaluation of 3D interconnect routing and stacking strategy to optimize high speed signal transmission for memory on logicJ Roullard, A Farcy, S Capraro, T Lacrevaz, C Bermond, G Houzet, ...2012 IEEE 62nd Electronic Components and Technology Conference, 8-13, 2012322012
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Intercomparison of permittivity measurement techniques for ferroelectric thin layersP Queffelec, V Laur, A Chevalier, JM Le Floch, D Passerieux, D Cros, ...Journal of Applied Physics 115 (2), 2014312014
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