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Thomas P Moffat
National Institute of Standards and Technology - Maryland / United States
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AD Scientific Index ID: 4383458
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Thomas P Moffat's MOST POPULAR ARTICLES
1-)
Superconformal electrodeposition of copper in 500–90 nm featuresTP Moffat, JE Bonevich, WH Huber, A Stanishevsky, DR Kelly, GR Stafford, ...Journal of The Electrochemical Society 147 (12), 4524, 20005562000
2-)
Superconformal film growth: Mechanism and quantificationTP Moffat, D Wheeler, MD Edelstein, D JosellIBM Journal of Research and Development 49 (1), 19-36, 20054382005
3-)
Superconformal electrodeposition of copperTP Moffat, D Wheeler, WH Huber, D JosellElectrochemical and Solid-State Letters 4 (4), C26, 20014182001
4-)
Electrodeposition of copper in the SPS-PEG-Cl additive system: I. kinetic measurements: Influence of SPSTP Moffat, D Wheeler, D JosellJournal of The Electrochemical Society 151 (4), C262, 20044122004
5-)
H2 evolution at Si-based metal–insulator–semiconductor photoelectrodes enhanced by inversion channel charge collection and H spilloverDV Esposito, I Levin, TP Moffat, AA TalinNature materials 12 (6), 562-568, 20133492013
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