Tim Tilford

Tim Tilford

University of Greenwich - London / United Kingdom
Natural Sciences / Mathematical Sciences
AD Scientific Index ID: 1270995
person_outline Tim Tilford's MOST POPULAR ARTICLES
1-) Wire bond reliability for power electronic modules-effect of bonding temperatureWS Loh, M Corfield, H Lu, S Hogg, T Tilford, CM Johnson2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007672007
2-) Lifetime prediction for power electronics module substrate mount-down solder interconnectH Lu, T Tilford, DR NewcombeHigh Density packaging and Microsystem Integration, 2007. HDP\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\'07 …, 2007652007
3-) Design, manufacture and test for reliable 3D printed electronics packagingT Tilford, S Stoyanov, J Braun, JC Janhsen, M Burgard, R Birch, C BaileyMicroelectronics Reliability 85, 109-117, 2018412018
4-) Microwave modeling and validation in food thawing applicationsT Tilford, E Baginski, J Kelder, K Parrott, K PericleousJournal of Microwave Power and Electromagnetic Energy 41 (4), 30-45, 2006402006
5-) Reliability analysis for power electronics modulesC Bailey, T Tilford, H Lu2007 30th International Spring Seminar on Electronics Technology (ISSE), 12-17, 2007322007