Tuhin Sinha

Tuhin Sinha

IBM Corporation - New York / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4892246
person_outline Tuhin Sinha's MOST POPULAR ARTICLES
1-) Finite element analysis of pharmaceutical tablet compaction using a density dependent material plasticity modelT Sinha, R Bharadwaj, JS Curtis, BC Hancock, C WassgrenPowder Technology 202 (1-3), 46-54, 2010752010
2-) A study on the sensitivity of Drucker–Prager Cap model parameters during the decompression phase of powder compaction simulationsT Sinha, JS Curtis, BC Hancock, C WassgrenPowder Technology 198 (3), 315-324, 2010752010
3-) Polygon die packagingTJ Davis, T SinhaUS Patent 9,911,716, 2018162018
4-) A systematic exploration of the failure mechanisms in underfilled flip-chip packagesT Sinha, TJ Davis, TE Lombardi, JT Coffin2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1509-1517, 2015162015
5-) Predicting thermo-mechanical degradation of first-level thermal interface materials (TIMs) in flip-chip electronic packagesT Sinha, JA Zitz, RN Wagner, S IruvantiFourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014122014