Woosuk Choi

Woosuk Choi

Samsung Electronics, South Korea - / South Korea
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4521940
삼성전자, 한국
person_outline Woosuk Choi's MOST POPULAR ARTICLES
1-) Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless nickel UBM-solder interface and their effects on flip chip solder joint reliabilityYD Jeon, KW Paik, KS Bok, WS Choi, CL Cho2001 Proceedings. 51st Electronic Components and Technology Conference (Cat …, 2001652001
2-) Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliabilityYD Jeon, KW Paik, KS Bok, WS Choi, CL ChoJournal of electronic materials 31 (5), 520-528, 2002642002
3-) Iron-42 wt pct nickel lead frame with palladium-electroplated multi-layer for semiconductor packagesJD Kim, YH Baek, WS Choi, KS BokPlating and surface finishing 86 (6), 113-116, 199981999
4-) Apparatus for roll-to-roll manufacturing semiconductor parts and feeding method thereofW Choi, D KimUS Patent 8,601,680, 201362013
5-) Semiconductor lead frame, semiconductor package having the same, and method of plating the sameW Choi, E Kim, S LeeUS Patent 7,501,692, 200962009