Xiao Cao

Xiao Cao

John Tyler Community College - - / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 5719829
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person_outline Xiao Cao's MOST POPULAR ARTICLES
1-) Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedanceX Cao, T Wang, KDT Ngo, GQ LuComponents, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 20111302011
2-) Transient thermal performance of IGBT power modules attached by low-temperature sintered nanosilverG Chen, D Han, YH Mei, X Cao, T Wang, X Chen, GQ LuIEEE Transactions on Device and Materials Reliability 12 (1), 124-132, 2011752011
3-) Planar power module with low thermal impedance and low thermomechanical stressX Cao, GQ Lu, KDT NgoIEEE Transactions on Components, Packaging and Manufacturing Technology 2 (8 …, 2012522012
4-) Transient thermal impedance measurements on low-temperature-sintered nanoscale silver jointsY Mei, T Wang, X Cao, G Chen, GQ Lu, X ChenJournal of electronic materials 41, 3152-3160, 2012342012
5-) Parametric Study of Joint Height for a Medium-Voltage Planar PackageX Cao, T Wang, KDT Ngo, GQ LuComponents and Packaging Technologies, IEEE Transactions on 33 (3), 553-562, 2010292010