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Yen-Ming Tseng
University of Akron - Akron / United States
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AD Scientific Index ID: 5411520
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Yen-Ming Tseng's MOST POPULAR ARTICLES
1-)
Thread size and polymer composition of 3D printed and electrospun wound dressings affect wound healing outcomes in an excisional wound rat modelN Nun, M Cruz, T Jain, YM Tseng, J Menefee, S Jatana, PS Patil, ...Biomacromolecules 21 (10), 4030-4042, 2020242020
2-)
Light-activated adhesion and debonding of underwater pressure-sensitive adhesivesYM Tseng, A Narayanan, K Mishra, X Liu, A JoyACS applied materials & interfaces 13 (24), 29048-29057, 2021182021
3-)
Role of pendant side-chain length in determining polymer 3D printabilityT Jain, W Clay, YM Tseng, A Vishwakarma, A Narayanan, D Ortiz, Q Liu, ...Polymer Chemistry 10 (40), 5543-5554, 2019152019
4-)
[Ni III (OMe)]-mediated reductive activation of CO 2 affording a Ni (κ 1-OCO) complexTW Chiou, YM Tseng, TT Lu, TC Weng, D Sokaras, WC Ho, TS Kuo, ...Chemical Science 7 (6), 3640-3644, 2016132016
5-)
Synthesis, rheology, and assessment of 3D printability of multifunctional polyesters for extrusion-based direct-write 3D printingT Jain, YM Tseng, C Tantisuwanno, J Menefee, A Shahrokhian, I Isayeva, ...ACS Applied Polymer Materials 3 (12), 6618-6631, 2021122021
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