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Yi-Shao Lai
Advanced Semiconductor Engineering Inc - / Taiwan
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AD Scientific Index ID: 4970032
高级半导体工程公司
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Yi-Shao Lai's MOST POPULAR ARTICLES
1-)
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition YS Lai, PF Yang, CL Yeh Microelectronics Reliability 46 (2-4), 645-650, 2006 2082006
2-)
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couplesPF Yang, YS Lai, SR Jian, J Chen, RS ChenMaterials Science and Engineering: A 485 (1-2), 305-310, 20081902008
3-)
Thermomigration in SnPb composite flip chip solder jointsAT Huang, AM Gusak, KN Tu, YS LaiApplied Physics Letters 88 (14), 20061872006
4-)
Advanced flip chip packagingHM Tong, YS Lai, CP WongSpringer US, 20131682013
5-)
Electromigration reliability and morphologies of Cu pillar flip-chip solder joints with Cu substrate pad metallizationYS Lai, YT Chiu, J ChenJournal of Electronic Materials 37, 1624-1630, 20081162008
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