Yong-Ho Ko

Yong-Ho Ko

Korea Institute of Industrial Technology - - / South Korea
Others
AD Scientific Index ID: 4516930
한국 산업 기술 연구소
person_outline Yong-Ho Ko's MOST POPULAR ARTICLES
1-) Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering Journal of Alloys and Compounds 679, 18-25, 2016
2-) Effect of Zn on the intermetallics formation and reliability of Sn-3.5 Ag solder on a Cu pad Journal of materials research 22, 1879-1887, 2007
3-) Facile and highly efficient fabrication of robust Ag nanowire–elastomer composite electrodes with tailored electrical properties Journal of Materials Chemistry C 6 (27), 7207-7218, 2018
4-) Controlling interfacial reactions and intermetallic compound growth at the interface of a lead-free solder joint with layer-by-layer transferred graphene ACS applied materials & interfaces 8 (8), 5679-5686, 2016
5-) Interfacial reactions and mechanical strength of Sn-3.0 Ag-0.5 Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications Microelectronics Reliability 71, 119-125, 2017