Yuling Niu

Yuling Niu

Binghamton University - Vestal / United States
Engineering & Technology / Mechanical Engineering
AD Scientific Index ID: 4850004
State University of New York at Binghamton
person_outline Yuling Niu's MOST POPULAR ARTICLES
1-) Comprehensive study on 2.5 D package design for board-level reliability in thermal cycling and power cyclingS Shao, Y Niu, J Wang, R Liu, S Park, H Lee, G Refai-Ahmed, L Yip2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1668-1675, 2018392018
2-) Design guideline of 2.5 D package with emphasis on warpage control and thermal managementJ Hong, K Choi, D Oh, SB Park, S Shao, H Wang, Y Niu2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 682-692, 2018392018
3-) Modeling and design of 2.5 D package with mitigated warpage and enhanced thermo-mechanical reliabilityJ Wang, Y Niu, S Park, A Yatskov2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2477-2483, 2018312018
4-) A Novel Speckle-Free Digital Image Correlation Method for In Situ Warpage CharacterizationY Niu, S Shao, S Park, CL KaoIEEE Transactions on Components, Packaging and Manufacturing Technology 7 (2 …, 2017322017
5-) A comprehensive solution for electronic packages\' reliability assessment with digital image correlation (DIC) methodY Niu, J Wang, S Shao, H Wang, H Lee, SB ParkMicroelectronics reliability 87, 81-88, 2018302018