Zhiguo Qian

Zhiguo Qian

Intel Corporation - California / United States
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4376875
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person_outline Zhiguo Qian's MOST POPULAR ARTICLES
1-) Embedded multi-die interconnect bridge (EMIB)--a high density, high bandwidth packaging interconnectR Mahajan, R Sankman, N Patel, DW Kim, K Aygun, Z Qian, Y Mekonnen, ...2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 557-565, 20162382016
2-) Fast full-wave surface integral equation solver for multiscale structure modelingZG Qian, WC ChewIEEE Transactions on Antennas and Propagation 57 (11), 3594-3601, 20092102009
3-) BRIDGE INTERCONNECT WITH AIR GAP IN PACKAGE ASSEMBLYC Chiu, Z Qian, MJ ManusharowUS Patent 20,150,011,050, 20151422015
4-) Generalized impedance boundary condition for conductor modeling in surface integral equationZG Qian, WC Chew, R SuayaIEEE Transactions on Microwave Theory and Techniques 55 (11), 2354-2364, 20071482007
5-) X-line routing for dense multi-chip-package interconnectsZ Qian, K AygunUS Patent 8,946,900, 20151342015