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Zhou Hai
Auburn University - Auburn / United States
Engineering & Technology / Industrial & Manufacturing Engineering
AD Scientific Index ID: 843182
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Zhou Hai's MOST POPULAR ARTICLES
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Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packagesJ Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ...IEEE transactions on components, packaging and manufacturing technology 3 (8 …, 20131242013
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Correlation of Aging Effects on Creep Rate and Reliability in Lead Free Solder JointsS J. C. Suhling Jiawei Zhang, Zhou HaiOrlando, F. L. "Journal of Surface Mount Technology." (2012) 25 (3), 19-28, 2012120*2012
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Thermal cycling reliability of aged PBGA assemblies-comparison of Weibull failure data and finite element model predictionsMM Basit, M Motalab, JC Suhling, Z Hai, J Evans, MJ Bozack, P Lall2015 IEEE 65th electronic components and technology conference (ECTC), 106-117, 2015672015
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Long term aging effects on the reliability of lead free solder joints in ball grid array packages with various pitch sizes and ball alignmentsC Zhao, C Shen, Z Hai, J Zhang, MJ Bozack, JL EvansSMTA International, 2015682015
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Reliability comparison of aged SAC fine-pitch ball grid array packages versus surface finishesZ Hai, J Zhang, C Shen, JL Evans, MJ Bozack, MM Basit, JC SuhlingIEEE Transactions on Components, Packaging and Manufacturing Technology 5 (6 …, 2015652015
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